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Rochester Electronics LLC |
| Part No. |
100324/VYA
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| Description |
100324 - TTL to ECL Translator, 6 Func, Complementary Output, ECL - Dual marked (5962-9153001VYA)
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
2SA1162
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| Description |
PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
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| Tech specs |
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Official Product Page
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International Rectifier, Corp.
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| Part No. |
2SC1162C
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| Description |
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits 晶体管|晶体管|叩| 35V的五（巴西）总裁| 2.5AI（丙）|26
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| File Size |
24.15K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
79821-162HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-5116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Electronic Theatre Controls, Inc.
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| Part No. |
CSC1162B
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| Description |
TRANSISTOR | BJT | NPN | 35V V(BR)CEO | 2.5A I(C) | TO-126 晶体管|晶体管|叩| 35V的五（巴西）总裁| 2.5AI（丙）|26
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| File Size |
38.17K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-4116-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-162-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127721-162GLF
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| Description |
Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75168-116-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-811162350LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3116-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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